Mass transfer to and copper deposition on a round bar in a new type of electrolytic cell: the helix cell

High-rate electrodeposition of Cu from CuSO sub 4-- H sub 2 SO sub 4 baths on Pt can be achieved by using crossflow of solution. To obtain Cu layers of uniform thickness and quality, a new type of electrolytic cell, the helix cell, has been proposed. An experimental dimensionless relation has been given to describe the mass transfer to a round bar, in crossflow, in a helix cell. Moreover, the current efficiency of Cu deposition has been obtained as a function of current density, flow rate of solution, temperature and wt% CuSO sub 4 in the CuSO sub 4-- H sub 2 SO sub 4 solution. Graphs. 12 ref.--AA