Improvements in aluminum adhesion and breakdown voltages of polyvinylidene fluoride films following exposure to gas plasmas

Improvements in aluminum adhesion and breakdown voltages of polyvinylidene fluoride films following exposure to gas plasmas

Changes in water wettability, improvement in adhesion of vapor deposited aluminum and increases in dielectric breakdown voltage in thin, 12 micron PVDF films were observed following brief exposure of these films to low‐temperature gas plasmas.

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Veröffentlicht in:Polymers for advanced technologies 1991-08, Vol.2 (4), p.209-210
Hauptverfasser: Mammone, Robert J., Wade Jr, William L., Binder, Michael
Format: Artikel
Sprache:eng
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Zusammenfassung:Changes in water wettability, improvement in adhesion of vapor deposited aluminum and increases in dielectric breakdown voltage in thin, 12 micron PVDF films were observed following brief exposure of these films to low‐temperature gas plasmas.
ISSN:1042-7147
1099-1581
DOI:10.1002/pat.1991.220020407