Grain size dependence of 1/f noise in Al-Cu thin-film interconnections

1/f noise measurements have been performed on Al-Cu thin films, of varying grain size, which were also subjected to electromigration lifetime tests. The results indicate a strong grain size dependence of the 1/f noise magnitude in the films. Moreover there is a correlation between electromigration lifetimes and values of 1/f noise magnitude, suggesting that 1/f noise measurements could be used as a nondestructive alternative to traditional electromigration testing.