Addition Curing Thermosets Endcapped With 4-Amino\2.2\Paracyclophane

A new family of addition curing polyimides were prepared that contained 4-amino-\2.2\-paracyclophane as the endcap. An improved synthesis of the endcap 4-amino-\2.2\cyclophane was accomplished, increasing the yield to 60% and simplifying the procedure. DSC and rheological analysis of endcapped polyimide oligomers confirmed that the onset for polymerization of the ethylene bridge was 250 deg C. exp 13 C CP/MAS NMR was used to determine the structural changes of the oligomers after thermal treatment. The cyclophane capped polyimides were successfully compression molded to form void free neat resin specimens. T sub g s as high as 353 deg C were obtained by thermomechanical analysis for postcured samples. Preliminary thermal stability studies (TGA) suggest that these resins have a high onset of decomposition ranging 549-567 deg C.