Studies of the interaction between aluminium and nickel, chromium and nichrome alloy films

The methods of electrochemical anodic dissolution and transmission electron microdiffraction have been used to study the kinetics of the interaction and composition of intermetallic compounds in the Al/Ni, Al/Cr and Al/(Ni-Cr alloy) thin film systems widely used in integrated circuits. The formation...

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Veröffentlicht in:	Thin solid films 1988-08, Vol.162, p.171-181
Hauptverfasser:	Gershinskii, A.E., Timofeeva, G.V., Shalygina, N.A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Exact sciences and technology Materials science Metals, semimetals and alloys Other nonelectronic physical properties Physical properties of thin films, nonelectronic Physics Solid surfaces and solid-solid interfaces Specific materials Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
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Beschreibung
Zusammenfassung:	The methods of electrochemical anodic dissolution and transmission electron microdiffraction have been used to study the kinetics of the interaction and composition of intermetallic compounds in the Al/Ni, Al/Cr and Al/(Ni-Cr alloy) thin film systems widely used in integrated circuits. The formation of the same intermetallic compounds, NiAl 3, Ni 2Al 3 and NiAl, has been found in both Al/Ni and Al/(Ni-Cr alloy) thin films with activation energies of 1.6±0.1 eV and 2.2 ±0.1 eV respectively. In addition, for Al/Ni-Cr the interactions occur at higher temperatures and the formation of nickel aluminides results in alloy decomposition followed by the formation of a layer of polycrystalline chromium.
ISSN:	0040-6090 1879-2731
DOI:	10.1016/0040-6090(88)90205-2