The inspection of solder joints on printed circuit boards by phase-shift holographic interferometry

The inspection of solder joints on printed circuit boards by phase-shift holographic interferometry

The principle of inspecting solder joints on printed circuit boards (PCBs) by phase-shift holographic interferometry is described. By using this technique, defective solder joints can be easily distinguished from good ones without analysing complicated holographic interferograms. Experiment shows th...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:NDT international 1990-06, Vol.23 (3), p.157-160
Hauptverfasser: Lu, Y.G., Jiang, L.Z., Zou, L.X., Geng, W.Z., Hong, J.
Format: Artikel
Sprache:eng
Schlagworte:
Applied sciences
Electronics
Exact sciences and technology
holographic interferometry
phase shift
solder joints
Testing, measurement, noise and reliability
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The principle of inspecting solder joints on printed circuit boards (PCBs) by phase-shift holographic interferometry is described. By using this technique, defective solder joints can be easily distinguished from good ones without analysing complicated holographic interferograms. Experiment shows that most defects in solder joints, such as breaks and voids, can be detected successfully.
ISSN:0308-9126
DOI:10.1016/0308-9126(90)90113-3