Aspects of the processing of semiconductor optoelectronic devices

Some of the problems are reviewed which currently inhibit the progress of optoelectronic integration. The importance of wet etching is highlighted in device fabrication whilst demonstrating its limits as a consequence of the general orientation dependence. The development of dry etching techniques for InP based compounds is reviewed. Processing methods for the fabrication of distributed feedback lasers, which are of importance in integrated schemes, are discussed. Finally an example of an integrated receiver device is given as a demonstration of state-of-the-art integration technology.