Effect of Heat Treatment on Mechanical Properties of Chemically Deposited Copper Films

An investigation was conducted on the effects of heat treatment on the mechanical properties and structure of copper films deposited from two types of electroless plating baths, one containing glycine and K4Fe (CN)6, and one containing ethylendiamine and 2, 2′-bipyridyl. Heat treatment was found to relieve lattice strains, causing an increase in elongation and a decrease in the half value width of X-ray diffraction patterns. Elongation following heat treatment for lh at 160°C was more than twice that for as-plated deposits. Good correlations were found between the increase in elongation and the decrease in half value width. The ultimate tensile strength for the deposits from baths containing ethylendiamine and 2, 2′-bipyridyl increased with heat treatment.