The emissivity of etched Cu-Nb in-situ alloys

Cu--Nb in situ alloys possess high strength plus thermal conductivity properties and are therefore of interest in heat transfer applications. Etching the surfaces of these alloys to preferentially remove Cu places the Nb filaments in relief. Experiments demonstrate that the emissivity of such etched...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	J. Appl. Phys.; (United States) 1987-04, Vol.61 (7), p.2621-2625
Hauptverfasser:	DOWNING, H. L, VERHOEVEN, J. D, GIBSON, E. D
Format:	Artikel
Sprache:	eng
Schlagworte:	656002 > Condensed Matter Physics-- General Techniques in Condensed Matter-- (1987-) ALLOYS CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY Condensed matter: electronic structure, electrical, magnetic, and optical properties COPPER ALLOYS Cross-disciplinary physics: materials science rheology EMISSIVITY ENERGY TRANSFER ETCHING Exact sciences and technology HEAT TRANSFER MATERIALS SCIENCE Metals, semimetals and alloys NIOBIUM ALLOYS Optical constants: refractive index, complex dielectric constant, absorption, reflection and transmission coefficients, emissivity OPTICAL PROPERTIES Optical properties and condensed-matter spectroscopy and other interactions of matter with particles and radiation Optical properties of bulk materials and thin films PHYSICAL PROPERTIES Physics Specific materials SURFACE FINISHING SURFACE PROPERTIES 360104 > Metals & Alloys-- Physical Properties SURFACE TREATMENTS
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Cu--Nb in situ alloys possess high strength plus thermal conductivity properties and are therefore of interest in heat transfer applications. Etching the surfaces of these alloys to preferentially remove Cu places the Nb filaments in relief. Experiments demonstrate that the emissivity of such etched surfaces can be increased from approx 0.08 to values > 0.9. 9 ref.--AA
ISSN:	0021-8979 1089-7550
DOI:	10.1063/1.337891