Recent advances in solid-phase epitaxial recrystallization of SOS with applications to CMOS and bipolar devices

Recent advances in solid-phase epitaxial recrystallization suggest that this technology may dramatically improve the crystallinity of heteroepitaxial silicon-on-insulators, such as silicon-on-sapphire (SOS). Recent improvements of 0.3- and 0.5-μm SOS films using two solid-phase epitaxial recrystalli...

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Veröffentlicht in:IEEE circuits and devices magazine 1987-07, Vol.3 (4), p.17-19
1. Verfasser: Vasudev, P. K.
Format: Artikel
Sprache:eng
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Zusammenfassung:Recent advances in solid-phase epitaxial recrystallization suggest that this technology may dramatically improve the crystallinity of heteroepitaxial silicon-on-insulators, such as silicon-on-sapphire (SOS). Recent improvements of 0.3- and 0.5-μm SOS films using two solid-phase epitaxial recrystallization processes (SPEAR and DSPE) are reported. Both techniques have reduced the total microtwin densities of SOS samples by more than 100-fold, while increasing electron and hole mobilities approximately 50%. The resulting properties are very close to those of bulk silicon. High-performance submicrometer CMOS devices and circuits in 0.3-μm recrystallized SOS films have been fabricated.
ISSN:8755-3996
1558-1888
DOI:10.1109/MCD.1987.6323128