Recent advances in solid-phase epitaxial recrystallization of SOS with applications to CMOS and bipolar devices
Recent advances in solid-phase epitaxial recrystallization suggest that this technology may dramatically improve the crystallinity of heteroepitaxial silicon-on-insulators, such as silicon-on-sapphire (SOS). Recent improvements of 0.3- and 0.5-μm SOS films using two solid-phase epitaxial recrystalli...
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Veröffentlicht in: | IEEE circuits and devices magazine 1987-07, Vol.3 (4), p.17-19 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Recent advances in solid-phase epitaxial recrystallization suggest that this technology may dramatically improve the crystallinity of heteroepitaxial silicon-on-insulators, such as silicon-on-sapphire (SOS). Recent improvements of 0.3- and 0.5-μm SOS films using two solid-phase epitaxial recrystallization processes (SPEAR and DSPE) are reported. Both techniques have reduced the total microtwin densities of SOS samples by more than 100-fold, while increasing electron and hole mobilities approximately 50%. The resulting properties are very close to those of bulk silicon. High-performance submicrometer CMOS devices and circuits in 0.3-μm recrystallized SOS films have been fabricated. |
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ISSN: | 8755-3996 1558-1888 |
DOI: | 10.1109/MCD.1987.6323128 |