Programs Help Spot Hot Spots

Computer-aided design software predicts and analyzes thermal conditions in circuits while they are under design, highlighting areas where cooling may be inadequate and so preventing failures due to thermal stress. The main reasons why thermal stress causes electronic components to fail are: 1. The components are highly susceptible to extremes of temperature. 2. Thermal factors often are neglected during a system's development. By identifying and fixing thermal problems at the design stage, the programs promise to improve the reliability of electronic devices, both military and consumer. Guidelines for designers and program managers include: 1. Establish specific thermal requirements. 2. Use thermal specialists when necessary. 3. Approach thermal issues at system level. The increasing power of computers and software has led to rapid advances in thermal analysis of electronic circuits. Hughes Aircraft Co.'s Product Analysis Laboratory has developed an automated system for printed circuit boards.