Effect of annealing on chemical state of phosphorus in SiO sub 2 films
ESCA data show that annealing increases P- O bonding compared to P- Si bonds as a function of temp. and time. The bonding affects physical and electrical behavior of VLSI devices.
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Veröffentlicht in: | Journal of the Electrochemical Society 1985-01, Vol.132 (4), p.932-936 |
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Hauptverfasser: | , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | ESCA data show that annealing increases P- O bonding compared to P- Si bonds as a function of temp. and time. The bonding affects physical and electrical behavior of VLSI devices. |
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ISSN: | 0013-4651 |