Nanowire facilitated transfer of sensitive TEM samples in a FIB

•A fast and facile nanowire-facilitated method for sensitive TEM sample transfer.•Applicable for the transfer of thin films and various mechanically (and beam) sensitive samples.•In particular, the method is suitable for in situ TEM sample preparation.•Results in significant reduction of sample bend...

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Veröffentlicht in:Ultramicroscopy 2020-12, Vol.219, p.113075-113075, Article 113075
Hauptverfasser: Gorji, Saleh, Kashiwar, Ankush, Mantha, Lakshmi S., Kruk, Robert, Witte, Ralf, Marek, Peter, Hahn, Horst, Kübel, Christian, Scherer, Torsten
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Sprache:eng
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Zusammenfassung:•A fast and facile nanowire-facilitated method for sensitive TEM sample transfer.•Applicable for the transfer of thin films and various mechanically (and beam) sensitive samples.•In particular, the method is suitable for in situ TEM sample preparation.•Results in significant reduction of sample bending, Pt contamination, and ion beam damage. We introduce a facile approach to transfer thin films and other mechanically sensitive TEM samples inside a FIB with minimal introduction of stress and bending. The method is making use of a pre-synthetized flexible freestanding Ag nanowire attached to the tip of a typical tungsten micromanipulator inside the FIB. The main advantages of this approach are the significantly reduced stress-induced bending during transfer and attachment of the TEM sample, the very short time required to attach and cut the nanowire, the operation at very low dose and ion current, and only using the e-beam for Pt deposition during the transfer of sensitive TEM samples. This results in a reduced sample preparation time and reduced exposure to the ion beam or e-beam for Pt deposition during the sample preparation and thus also reduced contamination and beam damage. The method was applied to a number of thin films and different TEM samples in order to illustrate the advantageous benefits of the concept. In particular, the technique has been successfully tested for the transfer of a thin film onto a MEMS heating chip for in situ TEM experiments.
ISSN:0304-3991
1879-2723
DOI:10.1016/j.ultramic.2020.113075