Electromigration and low-frequency resistance fluctuations in aluminum thin-film interconnections

Low-frequency noise spectra originating from resistance fluctuations in Al films during electromigration were measured in the absolute temperature and current density intervals 327 \leq T \leq 396 K and 1.34 \times 10^{6} \leq j \leq 2.22 \times 10^{6} A/cm 2 . The values of S R , the resistance pow...

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Veröffentlicht in:IEEE transactions on electron devices 1987-11, Vol.34 (11), p.2317-2322
Hauptverfasser: Neri, B., Diligenti, A., Bagnoli, P.E.
Format: Artikel
Sprache:eng
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Zusammenfassung:Low-frequency noise spectra originating from resistance fluctuations in Al films during electromigration were measured in the absolute temperature and current density intervals 327 \leq T \leq 396 K and 1.34 \times 10^{6} \leq j \leq 2.22 \times 10^{6} A/cm 2 . The values of S R , the resistance power spectral density, at 20 × 10 -3 Hz allowed the construction of an Arrhenius plot from which a grain-boundary activation energy value of about 0.6 eV was deduced. This value lies in the range of values found by other authors using different techniques. A first attempt to model the observed dependence of S R on j and T is also described.
ISSN:0018-9383
1557-9646
DOI:10.1109/T-ED.1987.23238