A new technique for the formation of ultrafine particles by sputtering

A gas evaporation technique using sputtering is newly developed. The characteristic of this new technique is the use of sputtering in an atmosphere of higher gas pressure such as 0.5 to 100 Torr than is used for ordinary sputtering. W, Ag and Cu are tested and their ultrafine particles are formed. W...

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Veröffentlicht in:	Japanese Journal of Applied Physics 1986, Vol.25 (1), p.L42-L44
Hauptverfasser:	YATSUYA, S, KAMAKURA, T, YAMAUCHI, K, MIHAMA, K
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Condensed matter: electronic structure, electrical, magnetic, and optical properties Cross-disciplinary physics: materials science rheology Electron and ion emission by liquids and solids impact phenomena Exact sciences and technology Impact phenomena (including electron spectra and sputtering) Materials science Metals, semimetals and alloys Optical properties and condensed-matter spectroscopy and other interactions of matter with particles and radiation Other electron-impact emission phenomena Other interactions of matter with particles and radiation Other techniques and industries Physics Specific materials
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Beschreibung
Zusammenfassung:	A gas evaporation technique using sputtering is newly developed. The characteristic of this new technique is the use of sputtering in an atmosphere of higher gas pressure such as 0.5 to 100 Torr than is used for ordinary sputtering. W, Ag and Cu are tested and their ultrafine particles are formed. WC 1- x particles are also prepared by reactive sputtering.
ISSN:	0021-4922 1347-4065
DOI:	10.1143/jjap.25.l42