Packaging and component technologies of future electronics

The report includes surveys of future trends in electronics packaging and component technologies from both international and national standpoints. The emphasis of the report is in the miniaturization of electronics and in the consequences to technologies in the long term. The report includes many of...

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Bibliographische Detailangaben

Veröffentlicht in:	Scientific and technical aerospace reports 2004-01, Vol.42 (2)
Hauptverfasser:	Lenkkeri, J, Majamaa, T, Jaakola, T, Karppinen, M, Kololuoma, T
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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