Packaging and component technologies of future electronics

The report includes surveys of future trends in electronics packaging and component technologies from both international and national standpoints. The emphasis of the report is in the miniaturization of electronics and in the consequences to technologies in the long term. The report includes many of the most important technologies in electronics manufacturing, their expectations and needs as well as their relationship to the increasing effectiveness of electronics circuits, increasing memory and data storage capacity, signal integrity and reliability of the circuits. Besides the trends of decreasing dimensions and increasing tolerance demands in electronics the most important targets of development are increasing modularity of devices, combining of electronics, photonics and mechanical components into same devices, development of new 3-dimensional design and testing tools and introducing new electronics materials.