A 30-ps Si bipolar IC using super self-aligned process technology
A new 30-ps Si bipolar IC technology has been developed by scaling down a bipolar transistor's lateral geometry and forming shallow junctions. The n-p-n transistor has a 0.35-µm-wide emitter and a 1.57-µm-wide base region fabricated using super self-aligned process technology (SST) with 1-µm ru...
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Veröffentlicht in: | IEEE transactions on electron devices 1986-04, Vol.33 (4), p.526-531 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | A new 30-ps Si bipolar IC technology has been developed by scaling down a bipolar transistor's lateral geometry and forming shallow junctions. The n-p-n transistor has a 0.35-µm-wide emitter and a 1.57-µm-wide base region fabricated using super self-aligned process technology (SST) with 1-µm rule optical lithography. The f T values achieved for this device are 13.7 GHz at a collector-emitter voltage of 1 V and 17.1 GHz at 3 V. Propagation delay times (fan-in = fan-out = 1) of 30 ps/gate at 1.48 mW/gate for nonthreshold logic and 50 ps/ gate at 1.46 mW/gate for low-level current mode logic have been achieved. |
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ISSN: | 0018-9383 1557-9646 |
DOI: | 10.1109/T-ED.1986.22523 |