A 30-ps Si bipolar IC using super self-aligned process technology

A new 30-ps Si bipolar IC technology has been developed by scaling down a bipolar transistor's lateral geometry and forming shallow junctions. The n-p-n transistor has a 0.35-µm-wide emitter and a 1.57-µm-wide base region fabricated using super self-aligned process technology (SST) with 1-µm ru...

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Veröffentlicht in:IEEE transactions on electron devices 1986-04, Vol.33 (4), p.526-531
Hauptverfasser: Konaka, S., Yamamoto, Y., Sakai, T.
Format: Artikel
Sprache:eng
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Zusammenfassung:A new 30-ps Si bipolar IC technology has been developed by scaling down a bipolar transistor's lateral geometry and forming shallow junctions. The n-p-n transistor has a 0.35-µm-wide emitter and a 1.57-µm-wide base region fabricated using super self-aligned process technology (SST) with 1-µm rule optical lithography. The f T values achieved for this device are 13.7 GHz at a collector-emitter voltage of 1 V and 17.1 GHz at 3 V. Propagation delay times (fan-in = fan-out = 1) of 30 ps/gate at 1.48 mW/gate for nonthreshold logic and 50 ps/ gate at 1.46 mW/gate for low-level current mode logic have been achieved.
ISSN:0018-9383
1557-9646
DOI:10.1109/T-ED.1986.22523