Dislocation-free undoped semi-insulating gaas epilayers prepared by chloride chemical vapor deposition and successive wafer annealing
Dislocation-free (DF) undoped semi-insulating GaAs epilayers have been realized by chloride chemical vapor deposition and successive wafer annealing. It was found that undoped conductive DF GaAs epilayers grown on Si-doped n-type DF GaAs substrates can be converted to semi-insulating by wafer anneal...
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Veröffentlicht in: | Journal of electronic materials 1996-12, Vol.25 (12), p.1841-1844 |
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Hauptverfasser: | , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Dislocation-free (DF) undoped semi-insulating GaAs epilayers have been realized by chloride chemical vapor deposition and successive wafer annealing. It was found that undoped conductive DF GaAs epilayers grown on Si-doped n-type DF GaAs substrates can be converted to semi-insulating by wafer annealing at temperatures higher than 950°C. The resistivity of these semi-insulating epilayers was higher than 10^sup 7^ ohmcm. The outdiffusion of Si from the substrate to the epilayer was analyzed by secondary ion mass spectrometry and it was found that the thickness of the outdiffusion region was only 1 µM. [PUBLICATION ABSTRACT] |
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ISSN: | 0361-5235 1543-186X |
DOI: | 10.1007/BF02657163 |