Dislocation-free undoped semi-insulating gaas epilayers prepared by chloride chemical vapor deposition and successive wafer annealing

Dislocation-free (DF) undoped semi-insulating GaAs epilayers have been realized by chloride chemical vapor deposition and successive wafer annealing. It was found that undoped conductive DF GaAs epilayers grown on Si-doped n-type DF GaAs substrates can be converted to semi-insulating by wafer anneal...

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Veröffentlicht in:Journal of electronic materials 1996-12, Vol.25 (12), p.1841-1844
Hauptverfasser: NODA, A, KOHIRO, K, ODA, O
Format: Artikel
Sprache:eng
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Zusammenfassung:Dislocation-free (DF) undoped semi-insulating GaAs epilayers have been realized by chloride chemical vapor deposition and successive wafer annealing. It was found that undoped conductive DF GaAs epilayers grown on Si-doped n-type DF GaAs substrates can be converted to semi-insulating by wafer annealing at temperatures higher than 950°C. The resistivity of these semi-insulating epilayers was higher than 10^sup 7^ ohmcm. The outdiffusion of Si from the substrate to the epilayer was analyzed by secondary ion mass spectrometry and it was found that the thickness of the outdiffusion region was only 1 µM. [PUBLICATION ABSTRACT]
ISSN:0361-5235
1543-186X
DOI:10.1007/BF02657163