Thermoactivated creep and stress relaxation in Cu and Al

Thermoactivation parameters of plastically deformed monocrystalline and polycrystalline Al and Cu in the temperature range 77 to 473 K are determined using the data about the kinetics of creep and mechanical stress relaxation. Also the characteristics of dislocation structures and the variation of the mobile dislocation density during relaxation processes are estimated. It is shown that the relaxation method gives reasonable values for the internal stress and dislocation mobility in a temperature range up to ≈ 0.3Tm. [Russian Text Ignored].