AlGaAs lasers with micro-cleaved mirrors suitable for monolithic integration

AlGaAs lasers with micro-cleaved mirrors suitable for monolithic integration

A technique has been developed for cleaving the mirrors of AlGaAs lasers without cleaving the substrate. Micro-cleaving involves cleaving a suspended heterostructure cantilever by ultrasonic vibrations. Lasers with microcleaved mirrors have threshold currents and quantum efficiencies identical to th...

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Veröffentlicht in:Appl. Phys. Lett.; (United States) 1982-02, Vol.40 (4), p.289-290
Hauptverfasser: Blauvelt, H., Bar-Chaim, N., Fekete, D., Margalit, S., Yariv, A.
Format: Artikel
Sprache:eng
Schlagworte:
ALUMINIUM ARSENIDES
ALUMINIUM COMPOUNDS
ARSENIC COMPOUNDS
ARSENIDES
CLEAVAGE
COMPARATIVE EVALUATIONS
CRYSTAL STRUCTURE
EFFICIENCY
ELECTRONIC CIRCUITS
ENGINEERING
GALLIUM ARSENIDES
GALLIUM COMPOUNDS
INTEGRATED CIRCUITS
LASERS
MECHANICAL VIBRATIONS
MICROELECTRONIC CIRCUITS
MICROSTRUCTURE
MIRRORS
PNICTIDES
QUANTUM EFFICIENCY
SEMICONDUCTOR DEVICES
SEMICONDUCTOR LASERS
SOUND WAVES 420300 > Engineering-- Lasers-- (-1989)
SUBSTRATES
ULTRASONIC WAVES
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Beschreibung
Zusammenfassung:A technique has been developed for cleaving the mirrors of AlGaAs lasers without cleaving the substrate. Micro-cleaving involves cleaving a suspended heterostructure cantilever by ultrasonic vibrations. Lasers with microcleaved mirrors have threshold currents and quantum efficiencies identical to those of similar devices with conventionally cleaved mirrors.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.93079