A liquid phosphorus-containing imidazole derivative as flame-retardant curing agent for epoxy resin with enhanced thermal latency, mechanical, and flame-retardant performances
[Display omitted] •A liquid phosphorus-containing imidazole derivate (DA) was synthesized and used as flame-retardant latent curing agent for EP.•DA exhibits good intermiscibility with EP, enhanced thermal latency, moderate curing temperature, and fast curing rate.•DA significantly enhanced the flam...
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Veröffentlicht in: | Journal of hazardous materials 2020-03, Vol.386, p.121984-121984, Article 121984 |
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Format: | Artikel |
Sprache: | eng |
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•A liquid phosphorus-containing imidazole derivate (DA) was synthesized and used as flame-retardant latent curing agent for EP.•DA exhibits good intermiscibility with EP, enhanced thermal latency, moderate curing temperature, and fast curing rate.•DA significantly enhanced the flame retardancy and mechanical properties of EP.
The development of phosphorus-containing flame retardants combining good compatibility with matrix, low curing temperature, and mechanically reinforcing effect has remained a major challenge. Herein, we reported the synthesis of a liquid flame-retardant curing agent (DA) via the nucleophilic substitution between diphenylphosphinic chloride and 1-(3-aminopropyl)-imidazole (AI). DA exhibited good blending and latency towards epoxy resin (EP) at room temperature. According to DSC studies, DA could rapidly cure EP at moderate temperature. Compared with EP/AI sample, EP/DA samples displayed comparable or higher glass transition temperature (Tg) and enhanced mechanical properties due to the introduction of rigid diphenylphosphinyl group and improved cross-linking density. Moreover, DA improved the flame-retardant performances of EP thermoset. For instance, the LOI and UL94 rating of EP/DA-16 sample achieved 37.2 % and V-0, respectively. In addition, the peak of heat release rate (PHRR), average of heat release rate (AHRR), fire growth rate (FIGRA), and total heat release (THR) for EP/DA-16 sample reduced by 32 %, 42 %, 28 % and 27 % in comparison to EP/AI sample, respectively. DA was characterized by its good compatibility with EP, moderate curing temperature, fast curing rate, suitable thermal latency, mechanical reinforcing and flame-retardant effects, and thus it had a broad application prospect in various industrial fields. |
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ISSN: | 0304-3894 1873-3336 |
DOI: | 10.1016/j.jhazmat.2019.121984 |