Planar monolithic integration of a photodiode and a GaAs preamplifier

A monolithic optical receiver chip consisting of a pin photodiode and a transimpedance preamplifier on a GaAs semi-insulating substrate is reported. The epitaxial layers for the photodiode are grown by hydride vapor phase epitaxy and the circuit elements are fabricated by selective ion implantation...

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Veröffentlicht in:Applied physics letters 1983-11, Vol.43 (9), p.821-823
Hauptverfasser: KOLBAS, R. M, ABROKWAH, J, CARNEY, J. K, BRADSHAW, D. H, ELMER, B. R, BIARD, J. R
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Sprache:eng
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Zusammenfassung:A monolithic optical receiver chip consisting of a pin photodiode and a transimpedance preamplifier on a GaAs semi-insulating substrate is reported. The epitaxial layers for the photodiode are grown by hydride vapor phase epitaxy and the circuit elements are fabricated by selective ion implantation in the semi-insulating substrate. The integration scheme results in a planar surface which simplifies the processing of optoelectronic integrated chips.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.94507