Boston Ivy Disk‐Inspired Pressure‐Mediated Adhesive Film Patches
Boston ivy (Parthenocissus tricuspidata) climbs brick walls using its tendril disks, which excrete a sticky substance to perform binding and attachment. While the cellular structures and adhesive substances involved have been identified for decades, their practical applicability as an adhesive has n...
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Veröffentlicht in: | Small (Weinheim an der Bergstrasse, Germany) Germany), 2020-03, Vol.16 (9), p.e1904282-n/a |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Boston ivy (Parthenocissus tricuspidata) climbs brick walls using its tendril disks, which excrete a sticky substance to perform binding and attachment. While the cellular structures and adhesive substances involved have been identified for decades, their practical applicability as an adhesive has not yet been demonstrated. A Boston ivy disk‐inspired adhesive film patch system is reported in which structural and compositional features of the Boston ivy disk are mimicked with a form of thin adhesive film patches. In analogy to the sticky disk of a mature ivy in which porous microchannels are occupied by catechol‐containing microgranules on the bound site, 3,4‐dihydroxylphenylalanine bolaamphiphile nanoparticle (DOPA‐C7 NP)‐coated alginate microgels are two‐dimensionally positioned into the cylindrical holes that are periodically micropatterned on the flexible stencil film. Finally, it is demonstrated that the pressurization of the patch breaks the microgels filled in the holes, releasing the polysaccharides and leading to crosslinking with DOPA‐C7 NPs via ligandation with combined Ca2+ and Fe3+ ions, thus enabling development of a pressure‐mediated adhesion technology.
A biomimetic strategy inspired from the Boston ivy tendril disk is proposed to fabricate pressure‐mediated adhesive film patches. It is shown that such adhesive patches are able to structurally and chemically mimic the Boston ivy disk, thus allowing the development of a biofriendly adhesive system with diverse functionalities. |
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ISSN: | 1613-6810 1613-6829 |
DOI: | 10.1002/smll.201904282 |