Dielectric breakdown of polyacetylene
Cis-(CH) x , with lower electronic conductivity, has a higher breakdown strength than trans-(CH) x , with higher conductivity. However, the breakdown strengths of both (CH) x film isomers are much lower than those of other insulating polymers such as PE, PS, etc. The breakdown strength of (CH) x inc...
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Veröffentlicht in: | Japanese Journal of Applied Physics 1983-11, Vol.22 (11), p.1734-1737 |
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Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
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Zusammenfassung: | Cis-(CH)
x
, with lower electronic conductivity, has a higher breakdown strength than trans-(CH)
x
, with higher conductivity. However, the breakdown strengths of both (CH)
x
film isomers are much lower than those of other insulating polymers such as PE, PS, etc.
The breakdown strength of (CH)
x
increases with increasing temperature from 77 K to around room temperature, and then above some critical temperature
T
c
, it decreases rapidly. This behavior can be explained in terms of an electronic breakdown process at lower temperatures and by a thermal process at higher temperatures. |
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ISSN: | 0021-4922 1347-4065 |
DOI: | 10.1143/jjap.22.1734 |