High-rate laser microprocessing handles large-area substrates
High-rate laser microprocessing is becoming a key enabling technology for modern microfabrication and production. Recent high-rate machining technology combines the advantages of high-power lasers and high-speed processing. There has been recent progress in the development of laser sources supplying...
Gespeichert in:
Veröffentlicht in: | Laser focus world 2019-10, Vol.55 (10), p.23 |
---|---|
Hauptverfasser: | , , |
Format: | Magazinearticle |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | High-rate laser microprocessing is becoming a key enabling technology for modern microfabrication and production. Recent high-rate machining technology combines the advantages of high-power lasers and high-speed processing. There has been recent progress in the development of laser sources supplying hundreds to thousands of watts of laser power with excellent beam quality, as well as high-average-power ultrafast lasers. Ultrafast scan systems, another core feature for high-rate machining, can avoid thermal damage to the substrates, even at high laser powers, by deflecting the laser beams at unprecedented speeds. 3D-Micromac provides a modular laser platform, called microSHAPE, to bring all those requirements together. The laser system is designed for high accuracy and high dynamic processing of large and flat glass and metal substrates. |
---|---|
ISSN: | 1043-8092 |