A Bezel‐Less Tetrahedral Image Sensor Formed by Solvent‐Assisted Plasticization and Transformation of an Acrylonitrile Butadiene Styrene Framework

A method for transforming planar electronic devices into 3D structures under mechanically mild and stable conditions is demonstrated. This strategy involves diffusion control of acetone as a plasticizer into a spatially designed acrylonitrile butadiene styrene (ABS) framework to both laminate membrane‐type electronic devices and transform them into a desired 3D shape. Optical, mechanical, and electrical analysis reveals that the plasticized region serves as a damper and even reflows to release the stress of fragile elements, for example, an Au interconnect electrode in this study, below the ultimate stress point. This method also gives considerable freedom in aligning electronic devices not only in the neutral mechanical plane of the ABS framework, which is the general approach in flexible electronics, but also to the top surface, without inducing electrical failure. Finally, to develop a prototype omnidirectional optical system with minimal aberrations, this method is used to produce a bezel‐less tetrahedral image sensor. Solvent‐assisted plasticization of a plastic framework enables the transformation of membrane‐type electronic devices in a stable manner. Controlling the bath temperature used to generate vapor, the exposure time and the framework geometry enable the redistribution of the rigidity in a framework that becomes deformable in a desired region without losing electronic performance. Finally, a bezel‐less tetrahedral image sensor is demonstrated.