Preferred diffusion paths for copper electromigration by in situ transmission electron microscopy

•Electromigration of copper interconnect was directly observed by in situ TEM study.•High-angle grain boundaries on free surfaces are the preferred Cu diffusion paths.•Depending on the orientation, twin boundaries can accelerate the electromigration.•Hillock development accompanies grain growth with...

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Veröffentlicht in:	Ultramicroscopy 2017-10, Vol.181, p.160-164
Hauptverfasser:	Oh, Young-Hwa, Kim, Sung-Il, Kim, Miyoung, Lee, Seung-Yong, Kim, Young-Woon
Format:	Artikel
Sprache:	eng
Schlagworte:	Copper Diffusion Electromigration In situ transmission electron microscopy Interconnect
Online-Zugang:	Volltext
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