Effects of the strain transmission from the main board to the installed electronic components

The paper presents research of mechanical strain in printed circuit board functional assemblies, which are parts of electronic packages in modern machines and mechanisms. The strain is caused by external impacts that occur in manufacturing and exploitation conditions. The paper studies effects of th...

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Veröffentlicht in:	Mechanika (Kaunas, Lithuania : 1995) Lithuania : 1995), 2016-11, Vol.22 (6), p.489
Hauptverfasser:	Kovtun, I, Boiko, J, Petrashchuk, S, Bauriene, G, Pilkauskas, K
Format:	Artikel
Sprache:	eng
Schlagworte:	Analysis Boards Circuit boards Circuit components Circuit printing Connectors Deformations (Mechanics) Electronic components Electronic devices Electronic modules Integrated circuits Mechanical properties Printed circuits Strain Strains and stresses Stress relaxation (Materials) Stress relieving (Materials)
Online-Zugang:	Volltext
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