Effects of the strain transmission from the main board to the installed electronic components

The paper presents research of mechanical strain in printed circuit board functional assemblies, which are parts of electronic packages in modern machines and mechanisms. The strain is caused by external impacts that occur in manufacturing and exploitation conditions. The paper studies effects of the strain transmission from the main board to the installed electronic components, such as integrated circuits, discrete components, adapters, sockets, connectors, electronic modules etc.: mount stress in elec-tronic components; strain effect of electronic component installation technologies; strain effect of integrated circuit installation technology; the influence of the main board load duration on the strain in mounted electronic modules; the strain in contact pads produced by bending of the main board. Acceptable limit specification method for main board warpage is developed.