Polarization Study of Sn-0.7Cu Solder Alloy in 1M Hydrochloric Solution

Polarization Study of Sn-0.7Cu Solder Alloy in 1M Hydrochloric Solution

Corrosion properties of Sn-0.7Cu solder were investigated in 1 M HCl. The scanning rates used were 0.5, 1.0, 1.5 and 2.0 mVs-1 to study the aggressiveness level of HCl electrolyte in various environment. The morphological, elemental and structural of the samples were compared before and after the co...

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Veröffentlicht in:Materials Science Forum 2017-03, Vol.888, p.394-399
Hauptverfasser: Mohd Nazeri, Muhammad Firdaus, OMAR, MOHD FIRDAUS, Mohd Rasid, Zarrul Azwan
Format: Artikel
Sprache:eng
Schlagworte:
Alloys
Copper
Corrosion
Corrosion products
Corrosion resistance
Electrodes
Electrolytes
Materials science
Morphology
Optimization
Polarization
Scanning
Software
Solders
Tin base alloys
X-rays
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Zusammenfassung:Corrosion properties of Sn-0.7Cu solder were investigated in 1 M HCl. The scanning rates used were 0.5, 1.0, 1.5 and 2.0 mVs-1 to study the aggressiveness level of HCl electrolyte in various environment. The morphological, elemental and structural of the samples were compared before and after the corrosion. Scan rate 1.0 mVs-1 was chosen as the most optimum scan rate during corrosion analysis. The morphological analysis observed two types of corrosion product which is compacted and loosely-compacted corrosion product after the samples was polarized in 1 M HCl.
ISSN:0255-5476
1662-9752
1662-9752
DOI:10.4028/www.scientific.net/MSF.888.394