High‐Operating‐Temperature Direct Ink Writing of Mesoscale Eutectic Architectures

High‐operating‐temperature direct ink writing (HOT‐DIW) of mesoscale architectures that are composed of eutectic silver chloride–potassium chloride. The molten ink undergoes directional solidification upon printing on a cold substrate. The lamellar spacing of the printed features can be varied betwe...

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Veröffentlicht in:Advanced materials (Weinheim) 2017-02, Vol.29 (7), p.np-n/a
Hauptverfasser: Boley, J. William, Chaudhary, Kundan, Ober, Thomas J., Khorasaninejad, Mohammadreza, Chen, Wei Ting, Hanson, Erik, Kulkarni, Ashish, Oh, Jaewon, Kim, Jinwoo, Aagesen, Larry K., Zhu, Alexander Y., Capasso, Federico, Thornton, Katsuyo, Braun, Paul V., Lewis, Jennifer A.
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Sprache:eng
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Zusammenfassung:High‐operating‐temperature direct ink writing (HOT‐DIW) of mesoscale architectures that are composed of eutectic silver chloride–potassium chloride. The molten ink undergoes directional solidification upon printing on a cold substrate. The lamellar spacing of the printed features can be varied between approximately 100 nm and 2 µm, enabling the manipulation of light in the visible and infrared range.
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.201604778