System for Cooling of Electronic Components

Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an...

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Veröffentlicht in:	Journal of engineering physics and thermophysics 2017, Vol.90 (1), p.95-101
Hauptverfasser:	Vasil’ev, L. L., Grakovich, L. P., Dragun, L. A., Zhuravlev, A. S., Olekhnovich, V. A., Rabetskii, M. I.
Format:	Artikel
Sprache:	eng
Schlagworte:	Classical Mechanics Complex Systems Cooling systems Copper (Metal) Copper products Diodes Electronic components Electronic components industry Electronic devices Engineering Engineering Thermodynamics Evaporation Heat and Mass Transfer Heat pipes Heat transfer Heat transmission Industrial Chemistry/Chemical Engineering Thermodynamics
Online-Zugang:	Volltext
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