System for Cooling of Electronic Components

Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40–50°C.