System for Cooling of Electronic Components
Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an...
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| Veröffentlicht in: | Journal of engineering physics and thermophysics 2017, Vol.90 (1), p.95-101 |
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| container_end_page | 101 |
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| container_issue | 1 |
| container_start_page | 95 |
| container_title | Journal of engineering physics and thermophysics |
| container_volume | 90 |
| creator | Vasil’ev, L. L. Grakovich, L. P. Dragun, L. A. Zhuravlev, A. S. Olekhnovich, V. A. Rabetskii, M. I. |
| description | Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40–50°C. |
| doi_str_mv | 10.1007/s10891-017-1543-8 |
| format | Article |
| fullrecord | <record><control><sourceid>gale_proqu</sourceid><recordid>TN_cdi_proquest_miscellaneous_1884115255</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><galeid>A497672276</galeid><sourcerecordid>A497672276</sourcerecordid><originalsourceid>FETCH-LOGICAL-c394t-d5befe6e55ce554ddc488898211cc84a4ef0d29d915cc2e3e8428757032850c03</originalsourceid><addsrcrecordid>eNp9kEFLwzAUx4MoOKcfwNuOinQmadKkxzGmDgaCU_AWavpSOtpkJim4b29GvewiIeTx8vs9Hn-EbgmeE4zFYyBYliTDRGSEszyTZ2hCuEiFIJ_nqcYFTb-UX6KrEHYY41KyfIIetocQoZ8Z52dL57rWNjNnZqsOdPTOtjp1-72zYGO4Rhem6gLc_L1T9PG0el--ZJvX5_Vyscl0XrKY1fwLDBTAuU6X1bVmUspSUkK0lqxiYHBNy7okXGsKOUhGpeAC51RyrHE-RXfj3L133wOEqPo2aOi6yoIbgiJSMkI45Tyh8xFtqg5Ua42LvtLp1NC3Oq1t2tRfsFIUglJRJOH-REhMhJ_YVEMIar19O2XJyGrvQvBg1N63feUPimB1TF2NqauUujqmrmRy6OiExNoGvNq5wdsU1z_SL78Kgik</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1884115255</pqid></control><display><type>article</type><title>System for Cooling of Electronic Components</title><source>SpringerLink Journals</source><creator>Vasil’ev, L. L. ; Grakovich, L. P. ; Dragun, L. A. ; Zhuravlev, A. S. ; Olekhnovich, V. A. ; Rabetskii, M. I.</creator><creatorcontrib>Vasil’ev, L. L. ; Grakovich, L. P. ; Dragun, L. A. ; Zhuravlev, A. S. ; Olekhnovich, V. A. ; Rabetskii, M. I.</creatorcontrib><description>Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40–50°C.</description><identifier>ISSN: 1062-0125</identifier><identifier>EISSN: 1573-871X</identifier><identifier>DOI: 10.1007/s10891-017-1543-8</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Classical Mechanics ; Complex Systems ; Cooling systems ; Copper (Metal) ; Copper products ; Diodes ; Electronic components ; Electronic components industry ; Electronic devices ; Engineering ; Engineering Thermodynamics ; Evaporation ; Heat and Mass Transfer ; Heat pipes ; Heat transfer ; Heat transmission ; Industrial Chemistry/Chemical Engineering ; Thermodynamics</subject><ispartof>Journal of engineering physics and thermophysics, 2017, Vol.90 (1), p.95-101</ispartof><rights>Springer Science+Business Media New York 2017</rights><rights>COPYRIGHT 2017 Springer</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c394t-d5befe6e55ce554ddc488898211cc84a4ef0d29d915cc2e3e8428757032850c03</citedby><cites>FETCH-LOGICAL-c394t-d5befe6e55ce554ddc488898211cc84a4ef0d29d915cc2e3e8428757032850c03</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10891-017-1543-8$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10891-017-1543-8$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27903,27904,41467,42536,51297</link.rule.ids></links><search><creatorcontrib>Vasil’ev, L. L.</creatorcontrib><creatorcontrib>Grakovich, L. P.</creatorcontrib><creatorcontrib>Dragun, L. A.</creatorcontrib><creatorcontrib>Zhuravlev, A. S.</creatorcontrib><creatorcontrib>Olekhnovich, V. A.</creatorcontrib><creatorcontrib>Rabetskii, M. I.</creatorcontrib><title>System for Cooling of Electronic Components</title><title>Journal of engineering physics and thermophysics</title><addtitle>J Eng Phys Thermophy</addtitle><description>Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40–50°C.</description><subject>Classical Mechanics</subject><subject>Complex Systems</subject><subject>Cooling systems</subject><subject>Copper (Metal)</subject><subject>Copper products</subject><subject>Diodes</subject><subject>Electronic components</subject><subject>Electronic components industry</subject><subject>Electronic devices</subject><subject>Engineering</subject><subject>Engineering Thermodynamics</subject><subject>Evaporation</subject><subject>Heat and Mass Transfer</subject><subject>Heat pipes</subject><subject>Heat transfer</subject><subject>Heat transmission</subject><subject>Industrial Chemistry/Chemical Engineering</subject><subject>Thermodynamics</subject><issn>1062-0125</issn><issn>1573-871X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><recordid>eNp9kEFLwzAUx4MoOKcfwNuOinQmadKkxzGmDgaCU_AWavpSOtpkJim4b29GvewiIeTx8vs9Hn-EbgmeE4zFYyBYliTDRGSEszyTZ2hCuEiFIJ_nqcYFTb-UX6KrEHYY41KyfIIetocQoZ8Z52dL57rWNjNnZqsOdPTOtjp1-72zYGO4Rhem6gLc_L1T9PG0el--ZJvX5_Vyscl0XrKY1fwLDBTAuU6X1bVmUspSUkK0lqxiYHBNy7okXGsKOUhGpeAC51RyrHE-RXfj3L133wOEqPo2aOi6yoIbgiJSMkI45Tyh8xFtqg5Ua42LvtLp1NC3Oq1t2tRfsFIUglJRJOH-REhMhJ_YVEMIar19O2XJyGrvQvBg1N63feUPimB1TF2NqauUujqmrmRy6OiExNoGvNq5wdsU1z_SL78Kgik</recordid><startdate>2017</startdate><enddate>2017</enddate><creator>Vasil’ev, L. L.</creator><creator>Grakovich, L. P.</creator><creator>Dragun, L. A.</creator><creator>Zhuravlev, A. S.</creator><creator>Olekhnovich, V. A.</creator><creator>Rabetskii, M. I.</creator><general>Springer US</general><general>Springer</general><scope>AAYXX</scope><scope>CITATION</scope><scope>ISR</scope><scope>7TB</scope><scope>7U5</scope><scope>8FD</scope><scope>FR3</scope><scope>KR7</scope><scope>L7M</scope></search><sort><creationdate>2017</creationdate><title>System for Cooling of Electronic Components</title><author>Vasil’ev, L. L. ; Grakovich, L. P. ; Dragun, L. A. ; Zhuravlev, A. S. ; Olekhnovich, V. A. ; Rabetskii, M. I.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c394t-d5befe6e55ce554ddc488898211cc84a4ef0d29d915cc2e3e8428757032850c03</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Classical Mechanics</topic><topic>Complex Systems</topic><topic>Cooling systems</topic><topic>Copper (Metal)</topic><topic>Copper products</topic><topic>Diodes</topic><topic>Electronic components</topic><topic>Electronic components industry</topic><topic>Electronic devices</topic><topic>Engineering</topic><topic>Engineering Thermodynamics</topic><topic>Evaporation</topic><topic>Heat and Mass Transfer</topic><topic>Heat pipes</topic><topic>Heat transfer</topic><topic>Heat transmission</topic><topic>Industrial Chemistry/Chemical Engineering</topic><topic>Thermodynamics</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Vasil’ev, L. L.</creatorcontrib><creatorcontrib>Grakovich, L. P.</creatorcontrib><creatorcontrib>Dragun, L. A.</creatorcontrib><creatorcontrib>Zhuravlev, A. S.</creatorcontrib><creatorcontrib>Olekhnovich, V. A.</creatorcontrib><creatorcontrib>Rabetskii, M. I.</creatorcontrib><collection>CrossRef</collection><collection>Gale In Context: Science</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of engineering physics and thermophysics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Vasil’ev, L. L.</au><au>Grakovich, L. P.</au><au>Dragun, L. A.</au><au>Zhuravlev, A. S.</au><au>Olekhnovich, V. A.</au><au>Rabetskii, M. I.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>System for Cooling of Electronic Components</atitle><jtitle>Journal of engineering physics and thermophysics</jtitle><stitle>J Eng Phys Thermophy</stitle><date>2017</date><risdate>2017</risdate><volume>90</volume><issue>1</issue><spage>95</spage><epage>101</epage><pages>95-101</pages><issn>1062-0125</issn><eissn>1573-871X</eissn><abstract>Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An efficient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer finning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40–50°C.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10891-017-1543-8</doi><tpages>7</tpages></addata></record> |
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| identifier | ISSN: 1062-0125 |
| ispartof | Journal of engineering physics and thermophysics, 2017, Vol.90 (1), p.95-101 |
| issn | 1062-0125 1573-871X |
| language | eng |
| recordid | cdi_proquest_miscellaneous_1884115255 |
| source | SpringerLink Journals |
| subjects | Classical Mechanics Complex Systems Cooling systems Copper (Metal) Copper products Diodes Electronic components Electronic components industry Electronic devices Engineering Engineering Thermodynamics Evaporation Heat and Mass Transfer Heat pipes Heat transfer Heat transmission Industrial Chemistry/Chemical Engineering Thermodynamics |
| title | System for Cooling of Electronic Components |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T07%3A19%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-gale_proqu&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=System%20for%20Cooling%20of%20Electronic%20Components&rft.jtitle=Journal%20of%20engineering%20physics%20and%20thermophysics&rft.au=Vasil%E2%80%99ev,%20L.%20L.&rft.date=2017&rft.volume=90&rft.issue=1&rft.spage=95&rft.epage=101&rft.pages=95-101&rft.issn=1062-0125&rft.eissn=1573-871X&rft_id=info:doi/10.1007/s10891-017-1543-8&rft_dat=%3Cgale_proqu%3EA497672276%3C/gale_proqu%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1884115255&rft_id=info:pmid/&rft_galeid=A497672276&rfr_iscdi=true |