Characteristics of End‐of‐Life Printed Wiring Boards Processed by Electrodynamic Fragmentation

Electrodynamic fragmentation (EDF) is an innovative technique which enables selective fragmentation of material. Its inherent selective breakage principles enable liberation while avoiding fine grinding. In this study, the specific effects of the EDF on end‐of‐life printed wiring boards have been assessed. A novel methodology for their EDF processing has been developed and compared with hammer mill shredding. Various energy inputs and treatment stages have resulted in fragmentation degrees ranging from removal of components to structure delamination and subsequent size reduction. Primary resource scarcity and the need to recycle end‐of‐life consumer goods lead to increasing recovery of high value metals from electronic waste. Copper liberation from printed wiring boards by electrodynamic fragmentation is investigated for various energy inputs and the results are compared to conventional hammer mill shredding.