Intermetallic growth kinetics of 2N gold wire ball bonds on aluminium bond pads annealed at 175 degree C

(ProQuest: ... denotes formulae and/or non-USASCII text omitted; see image).Gold ball bonding wires of 2N purity were bonded to Si devices with aluminium alloy bond pad metallisation. Specimens were subjected to isothermal annealing at 175 degree C in a fan-circulated oven in an air environment for various times t. Samples of ball bonds from each specimen were cross-sectioned, and the total intermetallic thickness x at the centre of the ball bonds was measured. The kinetics of x versus t were modelled using a power law expression ... with growth parameter [thetas] sub(1) and constrained parameter 0