The effect of high concentration of phosphorus in aluminum-induced crystallization of amorphous silicon films

Polycrystalline silicon (poly-Si) film prepared by aluminum-induced crystallization (AIC) of highly phosphorus (P)-doped amorphous silicon has been proposed for suppressing Si islands and voids. Si islands on the poly-Si surface and voids at the interface between the poly-Si and the glass are caused...

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Veröffentlicht in:Thin solid films 2016-11, Vol.618, p.50-54
Hauptverfasser: Hwang, Jun-Dar, Luo, Lee-Chi, Brahma, Sanjaya, Lo, Kuang-Yao
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Sprache:eng
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Zusammenfassung:Polycrystalline silicon (poly-Si) film prepared by aluminum-induced crystallization (AIC) of highly phosphorus (P)-doped amorphous silicon has been proposed for suppressing Si islands and voids. Si islands on the poly-Si surface and voids at the interface between the poly-Si and the glass are caused by Si atoms' out-diffusion toward the top surface during the AIC process, which also degrades the electrical characteristics of the film. High-P dopants can form P precipitations and retard the out-diffusion of Si atoms, hence suppressing Si islands and voids. Also, P precipitations can enhance the crystallization rate and grain growth. P dopants act as donors and compensate for the p-type poly-Si film, which is formed by Al doping during the AIC process. The hole concentration of undoped poly-Si is reduced by approximately three orders to 7×1012cm−3. Such near-neutral poly-Si films could be applied as intrinsic (i) layers in p-i-n structures to explore solar cell applications. Also, the enhanced quality of P-doped AIC-Si increases the mobility by five times owing to reduced scattering and trap density. •Polysilicon film from aluminum-induced crystallization (AIC) of high P-doped a-Si.•High-P dopants form P precipitations and retard the out-diffusion of Si atoms.•P precipitations in P-doped AIC-Si suppress Si islands and voids.•P precipitations could enhance the crystallization rate and grain growth.•High P-doped AIC-Si increases the mobility due to reduced scattering and trap density.
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2016.05.050