Thermal Strength of Adhesion Bond

Thermal Strength of Adhesion Bond

The article considers the one-dimensional problem of the destruction of the simplest model of adhesively engage consisting generally of the many plates, which are substrates (what are glued) and adhesives (glues). The ability of the model to resist to thermal impact without fracturing here conventio...

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Veröffentlicht in:Applied Mechanics and Materials 2014-10, Vol.670-671 (Applied Mechanics, Materials and Manufacturing IV), p.153-157
Hauptverfasser: Andreev, Vladimir I., Turusov, Robert A.
Format: Artikel
Sprache:eng
Schlagworte:
Adhesive bonding
Adhesive strength
Adhesives
Bonding strength
Fracturing
Mathematical models
Resists
Strength
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Beschreibung
Zusammenfassung:The article considers the one-dimensional problem of the destruction of the simplest model of adhesively engage consisting generally of the many plates, which are substrates (what are glued) and adhesives (glues). The ability of the model to resist to thermal impact without fracturing here conventionally called the thermal strength. The problem is solved in the elastic formulation.
ISSN:1660-9336
1662-7482
1662-7482
DOI:10.4028/www.scientific.net/AMM.670-671.153