Local-field method for resistivity and electromigration in metallic microstructures: application to thin films

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Veröffentlicht in:Physical review. B, Condensed matter Condensed matter, 1988-10, Vol.38 (11), p.7260-7274
Hauptverfasser: CHU, C. S, SORBELLO, R. S
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container_title Physical review. B, Condensed matter
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creator CHU, C. S
SORBELLO, R. S
description
doi_str_mv 10.1103/PhysRevB.38.7260
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ispartof Physical review. B, Condensed matter, 1988-10, Vol.38 (11), p.7260-7274
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1095-3795
language eng
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source American Physical Society Journals
subjects Analysing. Testing. Standards
Applied sciences
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures
Electronic transport phenomena in thin films and low-dimensional structures
Exact sciences and technology
Measurement of properties and materials state
Metals. Metallurgy
Nondestructive testing
Physics
title Local-field method for resistivity and electromigration in metallic microstructures: application to thin films
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