Local-field method for resistivity and electromigration in metallic microstructures: application to thin films

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Veröffentlicht in:	Physical review. B, Condensed matter Condensed matter, 1988-10, Vol.38 (11), p.7260-7274
Hauptverfasser:	CHU, C. S, SORBELLO, R. S
Format:	Artikel
Sprache:	eng
Schlagworte:	Analysing. Testing. Standards Applied sciences Condensed matter: electronic structure, electrical, magnetic, and optical properties Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures Electronic transport phenomena in thin films and low-dimensional structures Exact sciences and technology Measurement of properties and materials state Metals. Metallurgy Nondestructive testing Physics
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