Thermal Parameters, Tertiary Dendritic Growth and Microhardness of Directionally Solidified Al-3wt%Cu Alloy

The main purpose of this paper is to evaluate both tertiary dendritic arm growth and microhardness of Al-3wt%Cu alloy during horizontal directional solidification under transient heat flow conditions. Experimental thermal profiles recorded during solidification process allowed to determine growth rate and cooling rate values which are associated with both tertiary dendritic arm spacings and microhardness. The results show that initial tertiary branches growth only occurs when a cooling rate value of 1.14 K/s is reached. Variation of tertiary spacings is expressed as-1.1 and-0.55 power law functions of growth rate and cooling rate, respectively. A comparative analysis with other studies published in the literature that analyze tertiary dendritic growth of Al-Cu alloys considering transient directional solidification is carried out. Dependence of microhardness on dendritic arrangement is evaluated by experimental laws of power and Hall-Petch types with a view to permitting the applicability of the resulting expressions.