Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging
The effects of rare earth Nd on the whisker growth were investigated, it is found that the presence of Nd causes the risk of whisker growth due to the oxidation of RE-rich NdSn 3 intermetallic compounds. The relationships between average diameters of NdSn 3 , Nd contents, storage time, storage tempe...
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| Veröffentlicht in: | Journal of materials science. Materials in electronics 2016-09, Vol.27 (9), p.9584-9588 |
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| container_issue | 9 |
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| container_title | Journal of materials science. Materials in electronics |
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| creator | Zhang, Liang Yang, Fan Zhong, Su-juan |
| description | The effects of rare earth Nd on the whisker growth were investigated, it is found that the presence of Nd causes the risk of whisker growth due to the oxidation of RE-rich NdSn
3
intermetallic compounds. The relationships between average diameters of NdSn
3
, Nd contents, storage time, storage temperature and the whisker were tested, the oxidation mechanisms were selected to expound the whisker growth behavior. The compressive stress induced by volume expansion during oxidation procedure was suggested as the driving force for the growth of whisker in SnAgCu-xNd lead-free solders. |
| doi_str_mv | 10.1007/s10854-016-5012-5 |
| format | Article |
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3
intermetallic compounds. The relationships between average diameters of NdSn
3
, Nd contents, storage time, storage temperature and the whisker were tested, the oxidation mechanisms were selected to expound the whisker growth behavior. The compressive stress induced by volume expansion during oxidation procedure was suggested as the driving force for the growth of whisker in SnAgCu-xNd lead-free solders.</description><identifier>ISSN: 0957-4522</identifier><identifier>EISSN: 1573-482X</identifier><identifier>DOI: 10.1007/s10854-016-5012-5</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Compressive properties ; Electronics ; Intermetallic compounds ; Materials Science ; Neodymium ; Optical and Electronic Materials ; Oxidation ; Rare earth metals ; Solders ; Storage temperature</subject><ispartof>Journal of materials science. Materials in electronics, 2016-09, Vol.27 (9), p.9584-9588</ispartof><rights>Springer Science+Business Media New York 2016</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c349t-efbe336ca2bd5438e474cf18adc8ed4f41a0f73f3a7b0fd194dad7099ab978d43</citedby><cites>FETCH-LOGICAL-c349t-efbe336ca2bd5438e474cf18adc8ed4f41a0f73f3a7b0fd194dad7099ab978d43</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10854-016-5012-5$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10854-016-5012-5$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids></links><search><creatorcontrib>Zhang, Liang</creatorcontrib><creatorcontrib>Yang, Fan</creatorcontrib><creatorcontrib>Zhong, Su-juan</creatorcontrib><title>Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging</title><title>Journal of materials science. Materials in electronics</title><addtitle>J Mater Sci: Mater Electron</addtitle><description>The effects of rare earth Nd on the whisker growth were investigated, it is found that the presence of Nd causes the risk of whisker growth due to the oxidation of RE-rich NdSn
3
intermetallic compounds. The relationships between average diameters of NdSn
3
, Nd contents, storage time, storage temperature and the whisker were tested, the oxidation mechanisms were selected to expound the whisker growth behavior. The compressive stress induced by volume expansion during oxidation procedure was suggested as the driving force for the growth of whisker in SnAgCu-xNd lead-free solders.</description><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Compressive properties</subject><subject>Electronics</subject><subject>Intermetallic compounds</subject><subject>Materials Science</subject><subject>Neodymium</subject><subject>Optical and Electronic Materials</subject><subject>Oxidation</subject><subject>Rare earth metals</subject><subject>Solders</subject><subject>Storage temperature</subject><issn>0957-4522</issn><issn>1573-482X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNp1kM1LwzAYh4MoOKd_gLeAFy_RpEma9jiGXzAU_ABvIc1H161rZrI6_O9NqQcRPL2X5_nx8gBwTvAVwVhcR4ILzhAmOeKYZIgfgAnhgiJWZO-HYIJLLhDjWXYMTmJcYYxzRosJeL5xzuod9A4-Gug7uF82cW1DhHXw-90SVnapPhsfBuKlm9XzHkbfmoFoOmjbJAffNRpulV6ruunqU3DkVBvt2c-dgrfbm9f5PVo83T3MZwukKSt3yLrKUpprlVWGp18sE0w7UiijC2uYY0RhJ6ijSlTYGVIyo4zAZamqUhSG0Sm4HHe3wX_0Nu7kponatq3qrO-jJAXlOaWM5Qm9-IOufB-69F2iCC5FzjOeKDJSOvgYg3VyG5qNCl-SYDlUlmNlmSrLobIcnGx0YmK72oZfy_9K3xVrf4A</recordid><startdate>20160901</startdate><enddate>20160901</enddate><creator>Zhang, Liang</creator><creator>Yang, Fan</creator><creator>Zhong, Su-juan</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>F28</scope><scope>FR3</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L7M</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>S0W</scope></search><sort><creationdate>20160901</creationdate><title>Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging</title><author>Zhang, Liang ; Yang, Fan ; Zhong, Su-juan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c349t-efbe336ca2bd5438e474cf18adc8ed4f41a0f73f3a7b0fd194dad7099ab978d43</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Compressive properties</topic><topic>Electronics</topic><topic>Intermetallic compounds</topic><topic>Materials Science</topic><topic>Neodymium</topic><topic>Optical and Electronic Materials</topic><topic>Oxidation</topic><topic>Rare earth metals</topic><topic>Solders</topic><topic>Storage temperature</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zhang, Liang</creatorcontrib><creatorcontrib>Yang, Fan</creatorcontrib><creatorcontrib>Zhong, Su-juan</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>DELNET Engineering & Technology Collection</collection><jtitle>Journal of materials science. Materials in electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zhang, Liang</au><au>Yang, Fan</au><au>Zhong, Su-juan</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging</atitle><jtitle>Journal of materials science. Materials in electronics</jtitle><stitle>J Mater Sci: Mater Electron</stitle><date>2016-09-01</date><risdate>2016</risdate><volume>27</volume><issue>9</issue><spage>9584</spage><epage>9588</epage><pages>9584-9588</pages><issn>0957-4522</issn><eissn>1573-482X</eissn><abstract>The effects of rare earth Nd on the whisker growth were investigated, it is found that the presence of Nd causes the risk of whisker growth due to the oxidation of RE-rich NdSn
3
intermetallic compounds. The relationships between average diameters of NdSn
3
, Nd contents, storage time, storage temperature and the whisker were tested, the oxidation mechanisms were selected to expound the whisker growth behavior. The compressive stress induced by volume expansion during oxidation procedure was suggested as the driving force for the growth of whisker in SnAgCu-xNd lead-free solders.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10854-016-5012-5</doi><tpages>5</tpages></addata></record> |
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| ispartof | Journal of materials science. Materials in electronics, 2016-09, Vol.27 (9), p.9584-9588 |
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| language | eng |
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| subjects | Characterization and Evaluation of Materials Chemistry and Materials Science Compressive properties Electronics Intermetallic compounds Materials Science Neodymium Optical and Electronic Materials Oxidation Rare earth metals Solders Storage temperature |
| title | Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging |
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