Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging

Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging

The effects of rare earth Nd on the whisker growth were investigated, it is found that the presence of Nd causes the risk of whisker growth due to the oxidation of RE-rich NdSn 3 intermetallic compounds. The relationships between average diameters of NdSn 3 , Nd contents, storage time, storage tempe...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of materials science. Materials in electronics 2016-09, Vol.27 (9), p.9584-9588
Hauptverfasser: Zhang, Liang, Yang, Fan, Zhong, Su-juan
Format: Artikel
Sprache:eng
Schlagworte:
Characterization and Evaluation of Materials
Chemistry and Materials Science
Compressive properties
Electronics
Intermetallic compounds
Materials Science
Neodymium
Optical and Electronic Materials
Oxidation
Rare earth metals
Solders
Storage temperature
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The effects of rare earth Nd on the whisker growth were investigated, it is found that the presence of Nd causes the risk of whisker growth due to the oxidation of RE-rich NdSn 3 intermetallic compounds. The relationships between average diameters of NdSn 3 , Nd contents, storage time, storage temperature and the whisker were tested, the oxidation mechanisms were selected to expound the whisker growth behavior. The compressive stress induced by volume expansion during oxidation procedure was suggested as the driving force for the growth of whisker in SnAgCu-xNd lead-free solders.
ISSN:0957-4522
1573-482X
DOI:10.1007/s10854-016-5012-5