Electrodeposition of Zn and Cu–Zn alloy from ZnO/CuO precursors in deep eutectic solvent

Micro/nanostructured Zn and Cu–Zn alloy films have been electrodeposited directly from ZnO/CuO precursors in ChCl/urea-based DES, the typical nucleation-growth mechanism and the micro/nanostructures-formation process are determined. [Display omitted] •Micro/nanostructured Zn films have been electrodeposited directly from ZnO precursor in deep eutectic solvent (DES).•The morphology of the Zn electrodeposits depends on the cathodic potential and temperature.•The electrodeposited Zn films exhibit homogeneous morphologies with controllable particle sizes and improved corrosion resistance.•Cu–Zn alloy films have also been electrodeposited directly from their metal oxides precursors in DES. The electrodeposition of Zn and Cu–Zn alloy has been investigated in choline chloride (ChCl)/urea (1:2 molar ratio) based deep eutectic solvent (DES). Cyclic voltammetry study demonstrates that the reduction of Zn(II) to Zn is a diffusion-controlled quasi-reversible, one-step, two electrons transfer process. Chronoamperometric investigation indicates that the electrodeposition of Zn on a Cu electrode typically involves three-dimensional instantaneous nucleation with diffusion-controlled growth process. Micro/nanostructured Zn films can be obtained by controlling the electrodeposition potential and temperature. The electrodeposited Zn crystals preferentially orient parallel to the (101) plane. The Zn films electrodeposited under more positive potentials and low temperatures exhibit improved corrosion resistance in 3wt% NaCl solution. In addition, Cu–Zn alloy films have also been electrodeposited directly from CuO–ZnO precursors in ChCl/urea-based DES. The XRD analysis indicates that the phase composition of the electrodeposited Cu–Zn alloy depends on the electrodeposition potential.