Analysis and Evaluation of Electromagnetic Interference between ThruChip Interface and LC-VCO

Analysis and Evaluation of Electromagnetic Interference between ThruChip Interface and LC-VCO

This paper presents analysis and simple design guideline for ThruChip Interface (TCI) as located by LC-VCO which is used in high-speed SoC. The electromagnetic interference (EMI) from TCI channels to LC-VCO is analyzed and evaluated. The accuracy of the analysis and design guidelines is verified thr...

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Veröffentlicht in:IEICE Transactions on Electronics 2016/06/01, Vol.E99.C(6), pp.659-662
Hauptverfasser: KADOMOTO, Junichiro, HASEGAWA, So, KIUCHI, Yusuke, KOSUGE, Atsutake, KURODA, Tadahiro
Format: Artikel
Sprache:eng
Schlagworte:
3D integration
Channels
Design analysis
Design engineering
Electromagnetic interference
Electronics
EMI
Guidelines
High speed
LC-VCO
TCI
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Beschreibung
Zusammenfassung:This paper presents analysis and simple design guideline for ThruChip Interface (TCI) as located by LC-VCO which is used in high-speed SoC. The electromagnetic interference (EMI) from TCI channels to LC-VCO is analyzed and evaluated. The accuracy of the analysis and design guidelines is verified through the test-chip verification.
ISSN:0916-8524
1745-1353
DOI:10.1587/transele.E99.C.659