Ultrasonic Vibration in Leadframe for the Bondability for Au Wedge Bond

The in-situ inspection of ultrasonic vibration of wire bonder capillary was carried out using laser interferometer in order to analyze the formation of Au wedge bond. It was observed that the changes in ultrasonic vibration can be used to describe process of bonding formation. The loss of ultrasonic energy was exhibited in ultrasonic vibration waveform of wire bonding on leadframe A. This observation is due to the low frictional energy and high deformation of Au wedge bond on leadframe A. The lower pull strength obtained by Au wedge bond further confirms the reduction of bond formation on leadframe A.