Screening method for the onset of bonding of molten polyamide resin layers to continuous fiber reinforced laminate sheets
Thermoplastic polymer composites (TPC) with multiple fabric layers of continuous fiber reinforcement are laminate sheets designed to be thermally stamped and overmolded leading to low cycle times and thus high volume composite parts. Injection over-molding is one way to combine the high processabili...
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Veröffentlicht in: | Composites science and technology 2016-06, Vol.129, p.166-172 |
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Sprache: | eng |
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Zusammenfassung: | Thermoplastic polymer composites (TPC) with multiple fabric layers of continuous fiber reinforcement are laminate sheets designed to be thermally stamped and overmolded leading to low cycle times and thus high volume composite parts. Injection over-molding is one way to combine the high processability of thermoplastic melts with the less processable TPC sheets, for complex part making. To simulate the adhesion development during processes like over-molding, a non-isothermal screening method for bonding molten polyamide (PA) to a solid TPC surface has been developed and applied to evaluate differences in the threshold temperatures for good bond formation as a function of TPC matrix composition. Pure PA66 and aromatic high temperature nylons (PPA) in addition to miscible PPA blends comprising different ratios of PA66, were used as TPC matrices, and retain most of the very high melting point of 100% PPA. We have devised experiments to address two critical aspects: The first is to develop a screening test that probes very short timescales relevant to practical part making. The second is to investigate various miscible semi-crystalline blend ratios as matrices for the TPC where both blend species are crystalline. This allows us to explore a practical improvement of a lower required bonding temperature without substantially decreasing the high melting point of the PPA. DSC was also used to correlate the various blend melting transitions with the temperature required for the onset of bonding. The interfaces are shown to develop high strength partly because of substantial surface melting of certain blend components of the initially solid TPC, and this quickly allows interpenetration and inter-diffusion across the interface, which then crystallizes and strengthens during cooling. |
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ISSN: | 0266-3538 1879-1050 |
DOI: | 10.1016/j.compscitech.2016.04.030 |