Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling
The behavior of lead-free solder alloys under realistic service conditions is still not well understood. Life prediction of solder joints relies on conducting accelerated tests and extrapolating results to service conditions. This can be very misleading without proper constitutive relations and with...
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Veröffentlicht in: | Journal of electronic packaging 2016-06, Vol.138 (2) |
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Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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